多孔微热沉大功率LED阵列散热数值分析

n active cooling system that uses the porous micro heat sink is presented for thermal management of high power LED (light emitting diode) array, which is driven by a micro-pump. According to the analysis results, the maximum temperature of the chip would raise highly to 87 , without the micro-porous heat sink. With the help of the cooling system, the chip temperature is sharply reduced, and the cooling effect of this system is significantly improved. In addition, the different porosity and the fluid inlet velocity can affect the performance on thermal management of system. It can be drawn that the porous micro heat sink system can effectively solve the problem of heat transfer in high power LED array, and improve the performance and life of the LED chip.