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柱状微结构浸没喷射沸腾强化换热实验研究

中文摘要英文摘要

对电子芯片在FC-72工质中浸没喷射沸腾换热进行了实验研究。通过干腐蚀技术在硅片表面加工出50 μm × 60 μm,50 μm × 120 μm(宽×高)的柱状微结构,硅片尺寸为10 mm×10 mm×0.5 mm,过冷度分别为25、35 K,喷射速度Vj分别为0.5、1.0、1.5m/s。实验表明,临界热流密度随着喷射速度和过冷度的增加而增加,增加过冷度和喷射速度可减小气泡脱离时的尺寸,增加气泡脱离频率,因此提高了临界热流密度并且降低了壁面温度。此外,在单相对流换热区对流换热占据主导地位,热流密度随着壁面过热度线性增加;在核态沸腾换热区,对流换热与核态沸腾换热同时影响着换热过程。当喷射速度较小时,核态沸腾区曲线的斜率比单相对流区曲线的斜率大的多,显示出浸没喷射沸腾的优良换热性能。

he experiment was made of boiling heat transfer of FC-72 on micro-pin-finned chips with submerged jet impingement. The experimental conditions cover two different liquid subcoolings (25, 35 K), three different jet velocities (Vj = 0.5, 1.0, 1.5 m/s) in the direction perpendicular to chip surface. The dimension of the silicon chips is 10 mm 10 mm 0.5 mm (length width thickness) on which micro-pin-fins with the two dimensions of 50 50 60 m3 (width thickness height, named PF50-60) and 50 50 120 m3 (named PF50-120) were fabricated using the dry etching technique. For micro-pin-fins, the critical heat flux qCHF increases with jet velocity and liquid subcooling. Increasing liquid subcooling and jet velocity can decrease the size of bubbles separation, increase the detachment frequency and thus decrease the wall superheat and increase the critical heat flux. The heat transfer process is dominated by the forced convection in single-phase heat transfer region, and the heat flux increases linearly with increasing wall superheat. In the nucleate boiling region, the heat transfer is affected by both the forced convection and nucleate boiling heat transfer. The slope of nucleate boiling curve is larger than that in single-phase region when the jet velocity is small, indicating better heat transfer performance of boiling.

张永海,魏进家*,孔新

10.12074/201802.00077V1

热力工程、热机微电子学、集成电路

射流冲击沸腾强化换热柱状微结构

张永海,魏进家*,孔新.柱状微结构浸没喷射沸腾强化换热实验研究[EB/OL].(2018-02-01)[2025-08-21].https://chinaxiv.org/abs/201802.00077.点此复制

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