Integrated photonics incorporating 2D materials for practical applications
Integrated photonics incorporating 2D materials for practical applications
On-chip integration of 2D materials with exceptional optical properties provides an attractive solution for next-generation photonic integrated circuits to address the limitations of conventional bulk integrated platforms. Over the past two decades, significant advancements have been made in the interdisciplinary field of 2D material integrated photonics, greatly narrowing the gap between laboratory research and industrial applications. In this paper, we provide a perspective on the developments of this field towards industrial manufacturing and commercialization. First, we review recent progress towards commercialization. Next, we provide an overview of cutting-edge fabrication techniques, which are categorized into large-scale integration, precise patterning, dynamic tuning, and device packaging. Both the advantages and limitations of these techniques are discussed in relation to industrial manufacturing. Finally, we highlight some important issues related to commercialization, including fabrication standards, recycling, service life, and environmental implications.
David J. Moss
光电子技术微电子学、集成电路电子技术应用
David J. Moss.Integrated photonics incorporating 2D materials for practical applications[EB/OL].(2025-04-15)[2025-05-28].https://arxiv.org/abs/2504.11668.点此复制
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