Demonstration of highly scaled AlScN ferroelectric diode memory with storage density > 100 Mbit/mm$^2$

Wurtzite nitride ferroelectric materials have emerged as promising candidates for next-generation memory applications due to their exceptional polarization properties and compatibility with conventional semiconductor processing techniques. Here, we demonstrate the first successful scaling of Aluminum Scandium Nitride (AlScN) ferroelectric diode (FeDiode) memory down to 50 nm device diameters while maintaining functional performance. Using a 20 nm Al0.64Sc0.36N ferroelectric layer, we investigate both metal-insulator-ferroelectric-metal (MIFM) and metal-ferroelectric-metal (MFM) architectures to optimize device performance. Our scaled devices exhibit a previously unreported size-dependent behavior, where switching voltage decreases while breakdown field increases with miniaturization, resulting in an enhanced breakdown-to-coercive field ratio exceeding 2.6 for the smallest structures. This favorable scaling behavior enables reliable operation at reduced dimensions critical for high-density applications. The MIFM devices demonstrate stable 3-bit non-volatile multistate behavior with clearly distinguishable resistance states and retention exceeding $5\times 10^5$ seconds. This combination of scalability and simple structure enables an effective memory density of 100 Mbit/mm$^2$ under feature size of 50 nm. By achieving 50 nm scaling with enhanced performance metrics, this work establishes AlScN-based FeDiode memory as a highly promising platform for next-generation non-volatile storage with potential for direct integration into CMOS technology.