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结合屏蔽外壳的PCB辐射发射智能化预测方法

中文摘要英文摘要

针对目前无法对结合屏蔽外壳的印制电路板(Printed Circuit Board, PCB)数据进行有效辐射发射预测的问题。本文首先结合电磁屏蔽理论,提出了统一格式的屏蔽壳数据和PCB建模方法。建模过程中分析了屏蔽外壳中影响辐射发射的多重因素,之后将这些因素包括屏蔽外壳中各个面的材料及开孔信息数值化,并在仿真软件HFSS中完成屏蔽壳与PCB组合的辐射仿真计算,将该辐射发射数据与屏蔽壳和PCB数据组合形成电子设备系统的完备数据集。接着使用基于DNN的智能化辐射发射预测模型,在结合屏蔽外壳的数据集上完成训练预测。结果显示预测的平均绝对误差也较低,在0.0009左右,说明了本文提出的预测方法的预测精准与应用场景广泛、易于扩展的优势。

iming at the problem that it is not possible to effectively predict the radiation emission of Printed Circuit Board (PCB) data combined with shielding housing. In this paper, based on electromagnetic shielding theory, a unified form of shielding shell data and PCB modeling method are proposed. In the modeling process, multiple factors affecting radiation emission in the shielding shell were analyzed, and then these factors, including the material and hole information on each surface of the shielding shell, were numerically analyzed. The radiation simulation calculation of the combination of the shielding shell and PCB was completed in the simulation software HFSS, and the radiation emission data was combined with the shielding shell and PCB data to form a complete data set of the electronic device system. Then, an intelligent radiation emission prediction model based on DNN is used to complete the training prediction on the data set combined with the shielding shell. The results show that the average absolute error of the prediction is also low, about 0.0014, which shows that the prediction method proposed in this paper has the advantages of accurate prediction, wide application scenarios and easy expansion.

李城预

北京邮电大学电子工程学院

电子元件、电子组件电子技术应用

电磁兼容印制电路板辐射发射深度学习屏蔽外壳

Electromagnetic CompatibilityPrinted Circuit BoardRadiatedEmissionDeep LearningShield Housing

李城预.结合屏蔽外壳的PCB辐射发射智能化预测方法[EB/OL].(2025-04-29)[2025-05-02].http://www.paper.edu.cn/releasepaper/content/202504-233.点此复制

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