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FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates

Patrick Iff Maciej Besta Torsten Hoefler

来源：

Arxiv

FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates

Patrick Iff Maciej Besta Torsten Hoefler

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Patrick Iff,Maciej Besta,Torsten Hoefler.FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates[EB/OL].(2025-04-28)[2025-12-13].https://arxiv.org/abs/2504.19878.

学科分类

微电子学、集成电路

首发时间： 2025-04-28

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FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates

FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates

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