A Large Language Model Powered Integrated Circuit Footprint Geometry Understanding
A Large Language Model Powered Integrated Circuit Footprint Geometry Understanding
Printed-Circuit-board (PCB) footprint geometry labeling of integrated circuits (IC) is essential in defining the physical interface between components and the PCB layout, requiring exceptional visual perception proficiency. However, due to the unstructured footprint drawing and abstract diagram annotations, automated parsing and accurate footprint geometry modeling remain highly challenging. Despite its importance, no methods currently exist for automated package geometry labeling directly from IC mechanical drawings. In this paper, we first investigate the visual perception performance of Large Multimodal Models (LMMs) when solving IC footprint geometry understanding. Our findings reveal that current LMMs severely suffer from inaccurate geometric perception, which hinders their performance in solving the footprint geometry labeling problem. To address these limitations, we propose LLM4-IC8K, a novel framework that treats IC mechanical drawings as images and leverages LLMs for structured geometric interpretation. To mimic the step-by-step reasoning approach used by human engineers, LLM4-IC8K addresses three sub-tasks: perceiving the number of pins, computing the center coordinates of each pin, and estimating the dimensions of individual pins. We present a two-stage framework that first trains LMMs on synthetically generated IC footprint diagrams to learn fundamental geometric reasoning and then fine-tunes them on real-world datasheet drawings to enhance robustness and accuracy in practical scenarios. To support this, we introduce ICGeo8K, a multi-modal dataset with 8,608 labeled samples, including 4138 hand-crafted IC footprint samples and 4470 synthetically generated samples. Extensive experiments demonstrate that our model outperforms state-of-the-art LMMs on the proposed benchmark.
Yida Wang、Taiting Lu、Runze Liu、Lanqing Yang、Yifan Yang、Zhe Chen、Yuehai Wang、Yixin Liu、Kaiyuan Lin、Xiaomeng Chen、Dian Ding、Yijie Li、Yi-Chao Chen、Yincheng Jin、Mahanth Gowda
微电子学、集成电路电子元件、电子组件
Yida Wang,Taiting Lu,Runze Liu,Lanqing Yang,Yifan Yang,Zhe Chen,Yuehai Wang,Yixin Liu,Kaiyuan Lin,Xiaomeng Chen,Dian Ding,Yijie Li,Yi-Chao Chen,Yincheng Jin,Mahanth Gowda.A Large Language Model Powered Integrated Circuit Footprint Geometry Understanding[EB/OL].(2025-07-30)[2025-08-16].https://arxiv.org/abs/2508.03725.点此复制
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