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Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity

Sachin S. Sapatnekar Chaitali Chakrabarti Yu Cao Emad Haque Pragnya Sudershan Nalla Jeff Zhang

来源：

Arxiv

Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity

Sachin S. Sapatnekar Chaitali Chakrabarti Yu Cao Emad Haque Pragnya Sudershan Nalla Jeff Zhang

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Sachin S. Sapatnekar,Chaitali Chakrabarti,Yu Cao,Emad Haque,Pragnya Sudershan Nalla,Jeff Zhang.Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity[EB/OL].(2025-11-25)[2025-12-18].https://arxiv.org/abs/2511.10760.

学科分类

半导体技术/微电子学、集成电路

首发时间： 2025-11-25

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Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity

Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity

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