银烧结焊料对封装可靠性的影响研究进展
Research progress on the influence of silver sintered solder on packaging reliability
段学锋 1傅仁利2
作者信息
- 1. 南京航空航天大学材料科学与技术学院,南京，210000
- 2. 南京航空航天大学材料科学与技术学院
- 折叠
摘要
银烧结焊料凭借"低温烧结、高温服役"特性及优异的导热导电性、高熔点优势，已成为宽禁带半导体（SiC、GaN）器件封装的核心互连材料，其性能直接决定封装结构的长期可靠性。本文基于现有研究成果，分析银烧结焊料的烧结工艺参数（温度、时间、压力等）对微观结构（孔隙率、晶粒尺寸、界面结合状态）的调控规律，阐述微观结构演化与封装力学性能、电热性能及抗失效能力的关联机制，总结温度循环、振动、腐蚀等服役环境下的失效模式及可靠性评估模型，并展望未来发展方向，为银烧结焊料在电子封装领域的工程应用提供理论支撑。
Abstract
Silver sintered solder has emerged as the core interconnection material for wide-bandgap semiconductor (SiC, GaN) device packaging, owing to its characteristics of "low-temperature sintering and high-temperature service," along with excellent thermal/electrical conductivity and a high melting point. Its performance directly determines the long-term reliability of the packaging structure. Based on existing research findings, this paper analyzes the regulatory laws of silver sintered solder\'s sintering process parameters (temperature, time, pressure, etc.) on its microstructure (porosity, grain size, interfacial bonding state), elaborates on the correlation mechanisms between microstructural evolution and the packaging\'s mechanical properties, electrothermal performance, and failure resistance. Additionally, it summarizes the failure modes and reliability evaluation models under service environments such as thermal cycling, vibration, and corrosion, and prospects future development directions. This work provides theoretical support for the engineering application of silver sintered solder in the field of electronic packaging.关键词
银烧结焊料/封装可靠性/烧结工艺/微观结构/失效机理/寿命预测。Key words
Silver sintered solder/Packaging reliability/Sintering process/Microstructure/Failure mechanism/life prediction引用本文复制引用
段学锋,傅仁利.银烧结焊料对封装可靠性的影响研究进展[EB/OL].(2025-12-22)[2025-12-24].http://www.paper.edu.cn/releasepaper/content/202512-33.学科分类
电子元件、电子组件
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