Cu@Ag核壳纳米颗粒低温烧结行为的分子动力学模拟研究
Molecular Dynamics Simulation Study on the Low-Temperature Sintering Behavior of Cu@Ag Core-Shell Nanoparticles
刘佳伟 1刘佳胜 1马浩然 1谭维 1曹琦1
作者信息
- 1. 大连理工大学宽禁带半导体实验室，大连 116000
- 折叠
摘要
随着电力电子器件向高功率化和高集成度方向的发展，以碳化硅（SiC）为代表的宽禁带半导体材料因其优异的高频、高压、耐高温和低损耗等特性，在新能源汽车、车载逆变器等领域具有良好的应用前景。然而，SiC器件的工作温度往往可达300 ℃-500 ℃，传统的低熔点（<250 ℃）锡基封装焊料难以满足需求，亟待开发一种能够在高温条件下保持稳定性能的焊料，以保障当代SiC器件的高效运行。本文采用LAMMPS分子动力学模拟，建立了具有核壳结构的Cu@Ag纳米颗粒模型，研究了粒径及混合烧结、升温速率等因素对Cu@Ag核壳纳米颗粒烧结行为的影响。模拟结果表明，粒径分布、升温速率对Cu@Ag核壳纳米颗粒的烧结行为具有显著影响。适当的粒径组合（如2 nm与4 nm）能够促进更紧密的烧结结构形成，而粒径差异过大（如2 nm与8 nm）则会导致烧结速率下降及结构不均匀性增加。升温速率显著影响烧结启动温度及致密化过程，较低的升温速率有助于颗粒更早进入烧结阶段并形成更致密的结构。
Abstract
With the development of power electronic devices towards higher power and higher integration, wide bandgap semiconductor materials such as silicon carbide (SiC) have shown excellent characteristics such as high frequency, high voltage, high temperature resistance, and low loss, and thus have promising application prospects in fields like new energy vehicles and on-board inverters. However, the operating temperature of SiC devices often reaches 300 ℃ - 500 ℃, and traditional low melting point (<250 ℃) tin-based soldering materials are difficult to meet the requirements. It is urgent to develop a soldering material that can maintain stable performance under high-temperature conditions to ensure the efficient operation of contemporary SiC devices. This paper uses LAMMPS molecular dynamics simulation to establish a Cu@Ag nanoparticle model with a core-shell structure, and studies the effects of particle size and mixed sintering, heating rate, etc. on the sintering behavior of Cu@Ag core-shell nanoparticles. The simulation results show that the particle size distribution and heating rate have a significant impact on the sintering behavior of Cu@Ag core-shell nanoparticles. Appropriate particle size combinations (such as 2 nm and 4 nm) can promote the formation of a more compact sintered structure, while excessive particle size differences (such as 2 nm and 8 nm) will lead to a decrease in sintering rate and an increase in structural inhomogeneity. The heating rate significantly affects the sintering initiation temperature and densification process. A lower heating rate helps the particles enter the sintering stage earlier and form a more dense structure.关键词
Cu@Ag核壳纳米颗粒/烧结/分子动力学模拟Key words
Cu@Ag core-shell nanoparticles/sintering/Molecular dynamics simulation引用本文复制引用
刘佳伟,刘佳胜,马浩然,谭维,曹琦.Cu@Ag核壳纳米颗粒低温烧结行为的分子动力学模拟研究[EB/OL].(2026-03-17)[2026-03-20].http://www.paper.edu.cn/releasepaper/content/202603-151.学科分类
化学工业概论/电化学工业/电热工业、高温制品工业
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