厚石英玻璃光固化压印成型中的内应力抑制研究
Research on Internal Stress Suppression in Photocuring Imprinting of Thick Fused Silica Glas
摘要
光固化压印技术在制备厚石英玻璃元件时，紫外光在浆料中传播形成的固化梯度与光热效应引发的内应力，易导致成型及热处理过程中的微裂纹乃至宏观开裂。本研究针对此瓶颈，系统揭示了内应力的主要成因：紫外光衰减及其引发的固化前沿梯度，以及光热转化导致的非均匀温度场，阐明了两者协同作用下的应力累积与开裂机制。并提出了一种通过协同调控工艺参数以优化光场与热场的内应力抑制策略。采用该优化工艺成功制得直径7.30 mm、厚度4.38 mm的石英玻璃基片，其密度达2.202 g/cm³、可见光透过率>91%、维氏硬度1206.39 HV、表面粗糙度Ra=4.04 nm，性能接近熔融石英玻璃本征特性。
Abstract
In the preparation of thick fused silica glass components by photocuring imprinting technology, the curing gradient formed by UV light propagation in the slurry and the internal stress induced by photothermal effects can easily lead to microcracks or even macroscopic cracking during molding and subsequent heat treatment. To address this bottleneck, this study systematically reveals the main causes of internal stress: the attenuation of UV light and the resulting curing front gradient, as well as the non-uniform temperature field caused by photothermal conversion, and elucidates the stress accumulation mechanism and cracking failure mode under their synergistic effect. An internal stress suppression strategy is proposed to optimize the optical and thermal field distributions through cooperative regulation of process parameters. Using this optimized process, a fused silica glass substrate with a diameter of 7.30 mm and a thickness of 4.38 mm was successfully fabricated. Its density reaches 2.202 g/cm, visible light transmittance exceeds 91%, Vickers hardness is 1206.39 HV, and surface roughness Ra is 4.04 nm, exhibiting excellent comprehensive properties close to the intrinsic characteristics of fused silica glass.关键词
厚石英玻璃/光固化压印/内应力抑制Key words
Thick fused silica glass/Photocuring imprinting/Internal stress suppression引用本文复制引用
白春萌,陈彦萍,刘华.厚石英玻璃光固化压印成型中的内应力抑制研究[EB/OL].(2026-05-21)[2026-05-23].https://chinaxiv.org/abs/202605.00179.学科分类
材料科学/硅酸盐工业
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