Integrated circuits (ICs) are the foundation of advanced technologies such as artificial intelligence, high-performance computing, and 6G, and have become a strategic high ground in global technological competition and industrial security. Identifying the differences in the technological layout between China and the United States and exploring China’s potential technological opportunities is of great significance to achieving the high-quality and controllable development of China’s IC industry. This study systemically identifies and compares the technological layout and development characteristics of China and the United States in the integrated circuit industry based on the papers, patents, and standards of the two countries, using methods such as frequency word statistics, co-occurrence network, and topic clustering. The results show that China focuses more on the basic exploration of “materials—physical properties—devices,” while the United States focuses more on the full-chain integration of “process—design—systems.” The United States has formed a mature research and development ecosystem, while China’s basic research is active, but the transformation of research results into technological applications is still inadequate. Through the analysis of the matching of technology and standards, this study identifies four key technological opportunities in China’s integrated circuit industry: semiconductor materials and functional film technology, CMOS circuit design and high-speed information processing technology, advanced device structures and interconnection technology, and advanced packaging and heterogeneous integration technology. This study provides important references for China’s technological breakthroughs and standard layout in the integrated circuit industry.
关键词
技术机会识别/中美技术布局/技术与标准匹配/集成电路
Key words
technology opportunity identification/ technological layout/ technology and standard matching/ integrated circuit
