0.13μm显影工艺中喷嘴选择和程式改进的研究

With the critical dimension (CD) continuously decreasing in integrated circuit technology, the key technology of photolithography is facing a great challenge. To meet the semiconductor ULSI performance and reliability improvement, equipment needs update and optimization to match new technology platform. It brings a new task is that how to reach the process target without the process equipment update. The main solution is that modification of the hardware and optimization of the process condition. Especially the mainstream manufactory line inland are 8 inch techniques that are facing the 0.13μm technique level, the issue has more realistic meaning. This thesis through the study of experiment data of the development, try to cover the issue of the new process stage requirement by nozzle tip improvement and recipe optimize. In the end, we get the conclusion that the combination of LD nozzle and double scan recipe is the best solution to overcome the question. We also get many process factors that can keep process stable and controllable, for the need of 0.13μm process requirement and use for the product manufacture.