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一种用于光学器件封装的圆片级玻璃微透镜阵列的制备

Preparation of Packaging Cap with Binary Glass Microlenses for Wafer Level Packaging of Optical Devices

中文摘要英文摘要

本文介绍了一种使用Pyrex7740玻璃制备圆片级二元微透镜阵列的方法,它可以应用于红外探测器、LED等光学器件。本工艺基于硅微加工工艺,通过多次RIE工艺完成二元光学硅模具的制备,然后将刻蚀的硅圆片在真空条件下与Pyrex7740玻璃进行阳极键合;键合后的圆片加热到玻璃软化点之上,熔融态玻璃被压入硅槽内,并与二元光学结构的硅模具完全贴合。此外研究了熔融态玻璃进入硅槽的填充率与实验参数的关系。最后去除硅模具就制备出了用于封装的圆片级二元光学微透镜。结果显示所制备的二元光学微透镜对于波长为2.2um的红外线,焦距范围在1mm到100mm。当焦平面阵列集成二元光学透镜后,增加了探测器红外线吸收区域,提高了红外探测器的灵敏度。由于Pyrex7740玻璃在可见光和近红外光波段内具有很好的光学传输性质,所以二元光学微透镜可以应用于LED封装,通过使用玻璃二元微透镜能够实现一种小发射角和高出光率的LED封装。

In this pape a hot forming process of fabricating binary-optics microlenses for wafer-level-packaging of IR FPAs using Pyrex7740 glass is introduced. The process is based on etching stepwise structures in silicon, and binary-optics silicon-mold wafer is fabricated by a multilevel reactive-ion etching (RIE), followed by anodic bonding of a thin glass wafer to the etched silicon wafer under vacuum. The bonded wafers are then heated inside a furnace at a temperature above the softening point of the glass, and the glass is blown into the stepwise structure due to the atmospheric pressure. Besides, the filling rate of glass into the silicon cavity mold is also discussed. After the silicon mold is removed, glass packaging caps with wafer-level binary-optics microlenses for vacuum packaging are fabricated. Results show that packaging caps, which are of 620um×620um with focal lengths ranging from 1mm to 100 mm at 2.2 um wavelength, are prepared. While the FPAs are encapsulated by the packaging glass caps, the microlenses combined with the detector concentrate light sufficiently to increase the effective collection area, and IR detector's sensitivity is improvedIntroduction . Due to the excellent transmission efficiency in visible and near IR light of the Pyrex 7740 glass, the binary-optics microlenses may have potential application in the other optic devices including Light Emitting Diode (LED).

陈波寅、尚金堂、于慧、柳俊文、张迪、徐超、刘靖东、罗新虎

光电子技术电子元件、电子组件材料科学

二元光学微透镜阳极键合反应离子刻蚀聚焦

binary opticsmicrolensesanodic bondingRIEfocus

陈波寅,尚金堂,于慧,柳俊文,张迪,徐超,刘靖东,罗新虎.一种用于光学器件封装的圆片级玻璃微透镜阵列的制备[EB/OL].(2011-03-08)[2025-08-18].http://www.paper.edu.cn/releasepaper/content/201103-341.点此复制

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