From design to tape-out in SCL 180nm CMOS integrated circuit fabrication technology
From design to tape-out in SCL 180nm CMOS integrated circuit fabrication technology
微电子学、集成电路半导体技术
Joydeep Basu.From design to tape-out in SCL 180nm CMOS integrated circuit fabrication technology[EB/OL].(2019-08-24)[2025-09-24].https://arxiv.org/abs/1908.10674.点此复制
Although India has achieved considerable capability in electronic chip
design, but developing the infrastructure for capital-intensive semiconductor
fabrication remains a challenge. The rising domestic and global demand for
electronics products, the need of enhancing the country's high-technology
talent pool, employment generation, and national security concerns dictates the
Indian Government's heightened efforts in promoting electronics hardware
manufacturing in the country. A recent milestone in this regard is the setting
up of 180nm CMOS fabrication facility at SCL, Chandigarh. The Multi Project
Wafer runs of this indigenous foundry promises to be a relatively
cost-effective option for Indian academic and R&D institutions in realizing
their designed VLSI circuits. Written from the perspective of an Analog VLSI
designer, this tutorial paper strives to provide all the requisite information
and guidance that might be required in order to prepare chip designs for
submission to SCL for fabrication.
展开英文信息
评论