首页|From design to tape-out in SCL 180nm CMOS integrated circuit fabrication technology

From design to tape-out in SCL 180nm CMOS integrated circuit fabrication technology

Joydeep Basu

DOI：10.1080/09747338.2019.1657787

来源：

Arxiv

From design to tape-out in SCL 180nm CMOS integrated circuit fabrication technology

Joydeep Basu

作者信息

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Joydeep Basu.From design to tape-out in SCL 180nm CMOS integrated circuit fabrication technology[EB/OL].(2019-08-24)[2025-11-28].https://arxiv.org/abs/1908.10674.

学科分类

微电子学、集成电路/半导体技术

首发时间： 2019-08-24

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From design to tape-out in SCL 180nm CMOS integrated circuit fabrication technology

From design to tape-out in SCL 180nm CMOS integrated circuit fabrication technology

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