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首页|l和Nd对Sn-Zn基无铅钎料波峰焊抗氧化性研究

l和Nd对Sn-Zn基无铅钎料波峰焊抗氧化性研究

Investigation on oxidation resistance of Sn-Zn lead free solder alloys with Al and Nd in wave-soldering

中文摘要英文摘要

为提高Sn-Zn基无铅钎料抗氧化性尤其是波峰焊条件下的抗氧化性,通过合金化的方法在Sn-9Zn钎料基础上添加少量合金元素Al、Nd得到三元及四元合金钎料,比色分析和氧化层形貌分析结果表明,Al元素显著提高Sn-9Zn合金静态抗氧化性能,Nd元素的加入进一步改善Al氧化膜的完整性。通过对模拟波峰焊所得泡沫状混合物金相及扫描电镜分析,结果表明:该混合物内包含基体合金、气孔和氧化物,氧化物在合金基体内形成细小的富氧区域。Al和Nd元素复合添入后,即时在钎料表面形成氧化层阻碍钎料流体与氧气直接接触,泡沫状混合物内氧化物含量显著降低。

race elements Al and Nd are added into Sn-9Zn alloys in order to improve the oxidation resistance of the solders in wave soldering. The surface of oxidation film and foamy mixture generated in wave soldering are examined by colorimetric analysis,optical microscopy and scanning electronic microscopy. The results show that Al element can significantly enhance the static oxidation resistance of Sn-9Zn solders and the addition of Nd improve the smoothness of Al oxidation film further. The foamy mixture is composed of matrix alloy, porosity and oxide which leads to the formation of oxygen-rich areas. When Al and Nd elements are added simultaneously, the content of oxide in foamy mixture decrease markedly since a layer of oxidation film is formed on the surface of solders which hinder the contact of solder fluid and oxygen.

薛烽、周健、陈旭

材料科学焊接、金属切割、金属粘接

无铅钎料波峰焊lNd抗氧化性

lead free solderswave-solderingAlNdoxidation resistance

薛烽,周健,陈旭.l和Nd对Sn-Zn基无铅钎料波峰焊抗氧化性研究[EB/OL].(2011-12-30)[2025-08-05].http://www.paper.edu.cn/releasepaper/content/201112-893.点此复制

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