刚毛柽柳RING型E3泛素连接酶基因的克隆及表达分析
Cloning and Expression Analysis of RING E3 ubiquitin - ligase Gene from Tamarix hispida
E3泛素刚毛柽柳RING型E3泛素连接酶基因的克隆及表达分析连接酶是一个种类复杂的蛋白质家族,在对植物逆境胁迫的响应和生长发育等方面起重要的调节作用。通过对刚毛柽柳的转录组数据分析,鉴定获得一个E3泛素连接酶基因(ThE3)。ThE3基因cDNA全长2499bp,包含1275bp开放阅读框,编码424个氨基酸,编码蛋白相对分子质量45.8kDa,理论等电点(PI)为8.30。疏水性分析预测RING型E3泛素连接酶具有较强的亲水性,无信号肽及跨膜区,亚细胞定位于细胞核上。氨基酸多序列比对结果显示,ThE3与荷花的RING-finger类型E3泛素连接酶蛋白序列相似性最高,为76%,且具有RING-finger结构域,初步确定该基因为刚毛柽柳RING-finger类型E3泛素连接酶基因。实时荧光定量RT-PCR分析表明,ThE3表达受NaCl和PEG诱导,预示ThE3可能在刚毛柽柳适应高盐和干旱环境中发挥重要作用。
IThe ubiquitin ligase E3 is a complex protein family that plays an important role not only in plant growth and development but also in response to various stresses. A full length cDNA of a RING-type E3 ubiquitin ligase(named ThE3) was isolated from the transcriptome cDNA librarys of Tamarix hispida. ThE3 was 2499 bp in length, including an open reading frame of 1275 bp which was predicted to encode a polypeptide of 424 amino acids. The estimated molecular weight and isoelectric points of the putatCloning and Expression Analysis of RING E3 ubiquitin - ligase Gene from Tamarix hispidaive protein were 45.8 kD and 8.30, respectively. Hydrophobic analysis predicts that RING type E3 ubiquitin ligase has strong hydrophilicity, no signal peptide and transmembrane region, and subcellular localization on the nucleus.Amino acid sequence analysis shows that ThE3 show 76% similarities in amino acid sequence to homology from Nelumbo nucifera. And the RING-finger domain was used to determine the ThE3 as the RING-finger type E3 ubiquitin ligase gene of Tamarix hispida. Quantitative real-time PCR assay revealed that the mRNA levels of ThE3 was significantly up-regulated under NaCl and PEG treatments in Tamarix hispida, suggesting that ThE3 might play an improtant role in salt and drought tolerance of Tamarix hispida.
张春蕊、张悦、张玉、王超
分子生物学植物学
刚毛柽柳RING型E3泛素连接酶基因克隆基因表达
amarix hispidaRING-type E3 ubiquitin ligasegene cloninggene expression
张春蕊,张悦,张玉,王超.刚毛柽柳RING型E3泛素连接酶基因的克隆及表达分析[EB/OL].(2017-05-03)[2025-08-02].http://www.paper.edu.cn/releasepaper/content/201705-235.点此复制
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