u80Sn20无铅钎料的可靠性研究
Reliability Study Of Au80Sn20 Lead-free Solder
随着电子产品小型化,无铅化的发展,对焊料提出了更高的要求。无铅钎料Au80Sn20由于具有优良的力学性能在高可靠性气密封装和芯片焊接中被广泛应用。本文综述了近几年来Au80Sn20的发展状况,重点介绍了该焊料的可靠性研究。
with the miniaturized and lead-free development of electronic products ,higher demand is put forward about solder . Lead-free solder Au80Sn20 is widely applied in high reliable hermetic package and die welding due to excellent mechanical property.The text summarizes the development status of Au80Sn20 in recent several years,and emphasizes to introduce the reliability study of the solder.
范琳霞、荆洪阳、徐连勇
电子元件、电子组件材料科学
无铅钎料u80Sn20可靠性力学性能
Lead-free SolderAu80Sn20reliabilitymechanical property
范琳霞,荆洪阳,徐连勇.u80Sn20无铅钎料的可靠性研究[EB/OL].(2006-08-18)[2025-08-18].http://www.paper.edu.cn/releasepaper/content/200608-219.点此复制
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