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阳极键合用R2O-Al2O3-SiO2系微晶玻璃电学性能的研究

Electric Properties of R2O-Al2O3-SiO2 Glass Ceramics for Anodic Bonding

中文摘要英文摘要

通过对阳极键合用R2O-Al2O3-SiO2系微晶玻璃介电常数、介电损耗、电导率等电学性能测试,分析了热处理制度对其电学性能温度、频率特性的影响。结果表明:微晶玻璃的主晶相为偏硅酸锂晶体,与基础玻璃相比,其介电常数、介电损耗变小;随测试温度(室温~400℃)升高,各样品的介电常数、介电损耗逐渐增大;测试频率(30MHz~300MHz)对样品的介电性能影响较小;电导率随测试温度升高先减小后增大。选取合适的热处理制度,可以制备出介电常数和介电损耗较小、绝缘性能好,适合于作为在高频段工作的芯片封装用基片材料的微晶玻璃。

In this study, R2O-Al2O3-SiO2 system glass ceramics were used as anodic bonding materials, the effects of the heat treatment schedules on the electrical properties (dielectric constant, dielectric loss and conductivity) were discussed. The results showed that the main crystal phase of glass ceramics was lithium metasilicate(Li2SiO3); Comparing to the basic glass, both the dielectric constant and dielectric loss of glass ceramics decreased; the dielectric constant and dielectric loss were increased gradually with the increasing of the test temperature from room temperature to 400℃. Testing frequency(30MHz~300MHz)had very little influence on the performance of samples; with the rising of the temperature, the electrical conductivity of glass ceramics showed a trend of first decreasing and then increasing. The glass ceramics which had lower dielectric constant and dielectric loss, better stability under high frequency was obtained with an appropriate heat treatment schedule, which could be used as anodic bonding materials under high frequency.

李宏、熊德华、王倩、章钊、程金树

电工材料

阳极键合微晶玻璃介电常数介电损耗电导率

nodic BondingGlass Ceramicsielectric constantielectric lossElectrical conductivity

李宏,熊德华,王倩,章钊,程金树.阳极键合用R2O-Al2O3-SiO2系微晶玻璃电学性能的研究[EB/OL].(2009-04-03)[2025-08-16].http://www.paper.edu.cn/releasepaper/content/200904-113.点此复制

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