u掺杂的Hg0.75Cd0.25Te材料电子结构影响的第一性原理研究
Electronic properties of the Au impurity in Hg0.75Cd0.25Te: First-principles study
我们基于密度泛函理论平面波赝势的第一性原理方法,研究了Hg0.75Cd0.25Te(MCT)材料Au原位取代Hg(AuHg)以及Au的间隙(Aui)对体系的电子结构和成键机制的影响。通过Au掺杂的电荷密度、电子局域函数、态密度、形成能和动力学能级的理论分析,讨论了MBE和LPE两种生长方式下,Au的p型掺杂的稳定性和有效性。结果表明:Au取代Hg位后与体系中的原子具有很强的成键作用。AuHg缺陷的杂质能级较低靠近价带只有23 meV,所以Au在MCT中是一种较好的p型掺杂剂。Aui的费米能级被定扎在导带中,Au充当施主杂质。在富Hg的MBE生长条件下,由于AuHg和Aui 的自补偿效应影响,使得Au掺杂后的费米能级靠近导带,不能形成有效的p型掺杂。然而,在富Te的MBE和LPE生长条件下,没有自补偿效应,Au杂质可以充当有效的p型掺杂剂。
he structural and electronic properties of the gold in-situ impurity (AuHg) and gold interstitial defect (Aui) in Hg0.75Cd0.25Te (MCT) have been studied by plane-wave pseudopotential methods based on the density functional theory. Valence charge density, electron localization function (ELF), density of states and formation energy of gold impurity and defect were calculated to reveal the dopant stability and doping efficiency. The results indicate that the in-situ gold impurity maintains a relative strong bonding with the host atom. The impurity AuHg creates a shallow acceptor level that is 23 meV above VBM. However, the interstitial gold defect is dominant donor. Under Hg-rich MBE growth condition, due to the self-compensating effect between AuHg and Aui, the Fermi level is pinned close to CBM by which the gold impurity cannot behave as an efficient acceptor.Whereas under Te-rich MBE growth condition and LPE growth condition, the self-compensating effect is overcame and the in-situ gold impurity acts as an efficient p-type dopant.
陈元平、曲晓东、孙立忠、钟建新、韩金良
物理学半导体技术材料科学
化学势形成能动力学能级MCT
chemical trendformation energytransition energyMCT
陈元平,曲晓东,孙立忠,钟建新,韩金良.u掺杂的Hg0.75Cd0.25Te材料电子结构影响的第一性原理研究[EB/OL].(2008-11-12)[2025-08-22].http://www.paper.edu.cn/releasepaper/content/200811-328.点此复制
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