笼型倍半硅氧烷/氰酸脂树脂杂化材料研究
Study of the Polyhedral Oligomeric Silsesquioxane/cyanate ester resin
本文采用甲基笼型倍半硅氧烷（POSS）与氰酸酯树脂（CE）形成杂化材料对CE进行改性。研究了不同含量的POSS对氰酸酯树脂结构及性能的影响。利用FT-IR讨论了杂化材料体系的反应性，同时研究了POSS/氰酸酯树脂杂化体系的介电性能、热稳定性和耐湿热性能。POSS/CE杂化体系具有比氰酸酯树脂低的介电常数，有望用于高性能PCB基体材料。本文采用甲基笼型倍半硅氧烷（POSS）与氰酸酯树脂（CE）形成杂化材料对CE进行改性。研究了不同含量的POSS对氰酸酯树脂结构及性能的影响。利用FT-IR讨论了杂化材料体系的反应性，同时研究了POSS/氰酸酯树脂杂化体系的介电性能、热稳定性和耐湿热性能。POSS/CE杂化体系具有比氰酸酯树脂低的介电常数，有望用于高性能PCB基体材料。?
Methyl polyhedral oligomeric silsesquioxane (POSS) was incorporated into bisphenol A dicyanate (BADCy) to prepare organic-inorganic hybrid materials to modify CE. The effect of POSS content was studied with respect of the structure and properties of CE. The reactivity of the hybrid resin systems was investigated by using Fourier transforms infrared (FT-IR). Besides, the dielectric properties, thermal stability and hot/wet resistance were investigated. Results indicate that POSS/CE hybrid having a lower dielectric constant is a promising PCB matrix material.
张增平、梁国正
材料科学合成树脂工业、塑料工业高分子化合物工业
双酚A二型氰酸酯笼型倍半硅氧烷杂化材料改性
Polyhedral Oligomeric Silsesquioxane (POSS)Bisphenol A dicyanate (BADCy)hybrid materialsdielectric constant
张增平,梁国正.笼型倍半硅氧烷/氰酸脂树脂杂化材料研究[EB/OL].(2010-06-18)[2025-08-16].http://www.paper.edu.cn/releasepaper/content/201006-356.点此复制
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