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局域键平均近似固体热弹性

Local bond average for the temperature dependence of elastic modulus

中文摘要英文摘要

n analytical solution has been developed from the perspective of local bond average to correlating the elastic modulus of a specimen to the length and strength of the representative bonds and their response to temperature change. It is showed that the elastic weakening arises from the bond length expansion and the bond strength weakening by raising the inner energy. Reproduction of the measured temperature dependence of the elastic modulus of solid Ag, Au, MgO, Mg2SO4, Al2O3, and KCl specimens has led to information about the mean atomic cohesive energy of the specimens, which goes beyond the scope of available approaches.

n analytical solution has been developed from the perspective of local bond average to correlating the elastic modulus of a specimen to the length and strength of the representative bonds and their response to temperature change. It is showed that the elastic weakening arises from the bond length expansion and the bond strength weakening by raising the inner energy. Reproduction of the measured temperature dependence of the elastic modulus of solid Ag, Au, MgO, Mg2SO4, Al2O3, and KCl specimens has led to information about the mean atomic cohesive energy of the specimens, which goes beyond the scope of available approaches.

Ye Wenjiang、孙长庆、Li Yangxian、Yu Xiao、李佳

力学物理学材料科学

elastic modulus bond temperature

elastic modulus bond temperature

Ye Wenjiang,孙长庆,Li Yangxian,Yu Xiao,李佳.局域键平均近似固体热弹性[EB/OL].(2007-09-24)[2025-07-02].http://www.paper.edu.cn/releasepaper/content/200709-493.点此复制

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