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反应烧结碳化硅陶瓷素坯连接的研究

Joining of Reaction-Bonded Silicon Carbide Ceramics in green state

中文摘要英文摘要

以碳化硅和碳为糊料的主要原料,采用素坯连接的方法焊接RBSC陶瓷。探讨了糊料的碳密度、固相体积含量以及碳化硅颗粒级配对焊缝显微结构和机械性能的影响。研究表明,糊料碳密度为0.84~0.86 g·cm-3,固相体积含量达57vol%,焊料粘度略大于1Pa·s时,连接素坯烧结后的焊缝强度可达375MPa。研究表明焊缝具有和母材相似的显微结构是连接强度得以提高的原因。

Joining in green state between reaction-bonded silicon carbide (RBSC) were researched using carbide and silicon carbide paste as joining materials. The effects of carbonous density、solid volume and silicon carbide powders with different particle size distribution loading on the microstructures, performance and the humidity of basis materials on the strength of basis material and paste were investigated. The results show that the solder with carbonous density varying from 0.84g/cm3 to 0.86g/cm3 ,solid volume loading being 57% ,and the viscosity being over 1Pa·s,the strength of the welding joints is 375MPa. Reason of high intensity of welding seam is the same structure of welding joints as structure of RBSC.

邓明进、叶春燕、武七德

材料科学非金属元素化学工业、非金属无机化合物化学工业

碳化硅 RBSC 素坯连接

silicon carbideRBSCjoining in green state

邓明进,叶春燕,武七德.反应烧结碳化硅陶瓷素坯连接的研究[EB/OL].(2007-04-16)[2025-08-02].http://www.paper.edu.cn/releasepaper/content/200704-402.点此复制

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