荧光XAFS研究超硬TiN/Si3N4多层膜的界面效应
Interfacial effects of TiN/Si3N4 super-hard multilayer films studied by fluorescence x-ray absorption fine structure
本文采用荧光XAFS和XRD研究了磁控溅射法制备的在20、200、500和800°C生长的超硬TiN/Si3N4多层膜的结构。结果表明生长温度对TiN与Si3N4界面混合层的结构和厚度有较大的影响,TiSixN1-x界面混合层仍保持TiN薄膜的NaCl晶型的结构。当生长温度从20°C升高到500°C时,TiN层的晶化程度显著增加,界面混合层的厚度由2.5埃增加到5.0埃。对800°C生长的TiN/Si3N4多层膜样品,界面混合层为TiSi0.3N0.7固溶体,其厚度达到7.8埃,并且Ti-N键长(2.06埃)相对于TiN层中的Ti-N键长(2.12埃)明显收缩。我们认为TiSixN1-x界面混合层中Ti-N键长收缩是高温生长的晶态/非晶TiN/Si3N4多层膜的硬度增加的主要原因。
Fluorescence x-ray absorption fine structure (XAFS) and x-ray diffraction (XRD) are used to study the structures of super-hard TiN/Si3N4 multilayer films deposited by reactive magnetron sputtering at temperatures of 20, 200, 500 and 800 °C. The resultsclearly reveal the presence of interfacial intermixing between adjacent TiN and Si3N4 layers. And the interlayer is composed of TiSixN1-x solid solution with a NaCl-like structure. Increasing the growth temperature from 20 to 500 oC, the crystalline quality of pure TiN layer improves significantly, and the thickness of interlayer rises from 2.5 to 5.0 A. For the TiN/Si3N4 multilayer film grown at 800 oC, the interfacial layer is composed of TiSi0.3N0.7 solid solution and reaches the thickness of 7.8 A, where the Ti-N bond length (2.06 A) is significantly shrunk as compared with the value (2.12 A) in the pure TiN layer. We propose that the TiSixN1-x interlayer with obviously contracted Ti-N bond length is an important hardening factor for the crystalline/amorphous TiN/Si3N4 multilayer films grown at high temperatures.
Zhihu Sun、潘志云、Shiqiang Wei、Luyuan Hao、Zhi Xie
材料科学物理学晶体学
荧光XAFS,TiN/Si3N4多层膜,界面
iN/Si3N4 multilayer films interlayer Fluorescence XAFS
Zhihu Sun,潘志云,Shiqiang Wei,Luyuan Hao,Zhi Xie.荧光XAFS研究超硬TiN/Si3N4多层膜的界面效应[EB/OL].(2005-11-29)[2025-08-16].http://www.paper.edu.cn/releasepaper/content/200511-444.点此复制
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