薄膜微细观力学性能有限元分析
he finite element analysis for micromechanical properties of thin films
在材料强度科学和断裂力学看来，裂纹是灾难，它使许多工程构件突然断裂，造成恶性事故。本文是将实际的SEM图片进行图像的数字化处理，利用ANSYS的生死单元功能模拟裂纹的扩展路径，对比不同混杂比的情况下的裂纹的扩展路径以及裂纹尖端的应力强度因子，对以后裂纹的研究具有指导意义。
From the view of material intensity science and fracture mechanics crackles mean nothing but damages.The SEM micrograph is digitized in this paper, then the crack propagation path is modeled by functional unit of life and death of ANSYS software, and the crack propagation path and stress intensity factor of crack tip are compared, and future research woulde be guided by the result.
周霞、牟睿敏
材料科学工程基础科学
裂纹扩展路径应力强度因子有限元分析
rack propagation pathStress intensity factorFEA
周霞,牟睿敏.薄膜微细观力学性能有限元分析[EB/OL].(2011-06-07)[2025-08-23].http://www.paper.edu.cn/releasepaper/content/201106-149.点此复制
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