多孔金刚石坯体熔渗铜工艺研究

iamond / copper composites have good thermal-physical properties and they could be net-shape formed by infiltration. In this research, relevant process and influencing factors of porous diamond preforms infiltrated by copper were studies. The results showed that it is helpful to infiltration of copper into diamond preforms when the copper were both placed on the top and at the bottom of the preform. The density of the composites could reach 99.8% near full density at 1200 C with the pressure of 20MPa for 30 min and thermal conductivity can reach 587 W / m o K. There is no obvious change for the density by further incerasing the infiltration temperature and holding time. But the thermal conductivity droped. This was associated with the increase of interfacial thermal resistance due to the change of interface structure. There is an incubation period during the pressure infiltration process. The density was lower when infiltration temperature was below 1200 C or pressure was less than 20MPa, even that infiltration can not be completed.