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带有片上补偿电感的CMOS分布式放大器的设计与分析

esign and Analysis of a CMOS Distributed Amplifier with On-Chip Compensate Inductance

中文摘要英文摘要

随着科技的发展时代的进步,通信数据量呈指数趋势上升,这就要求有线和无线通信应具有更高速度和更大带宽。分布式放大器基于分布原理及传输线理论进行设计,克服了传统放大器寄生电容的影响,以其极宽的带宽及平坦的增益成为现今高速通信专用集成电路的最佳选择。本次设计基于TSMC90nm RF的CMOS工艺,采用4级增益单元作为一级放大器,两级级联的结构。此分布式放大器实现了在260M-27.3GHz的频带内平坦增益带宽保持在18.0dB±1.0dB,其单位增益带宽为32.5G,功耗为78mW。本文着重于分析改进的结构对于平坦增益与扩展带宽的优化作用。

With the development of the science and advancement of times, the number of communication data improve with a trend of exponent which demands higher speed and larger bandwidth of wire/wireless communication. The distributed amplifier is designed according to the distributed principle and transmission line theory, and overcomes the adverse the effects of parasitic capacitance to conventional amplifier, it becomes the optimal choice in modern high-speed communication integrated circuit for its extremely wide bandwidth and flat gain. This circuit has been designed under TSMC90nm RF CMOS process, it's a two stage cascaded amplifier, where each stage is composed by four gain cells. This design can achieve 18.0dB±1.0dB flat gain from 260M to 27.3GHz and its unity gain bandwidth is 32.5G, while consuming dc power of 78mW. This article focus on analyzing the optimizing effect of the improved structure on flat gain and bandwidth enlargement.

王兴华、仲顺安

微电子学、集成电路电子电路通信

微电子与固体物理学分布式放大器片上补偿MOS工艺

micro-electronics and solid-state physicsdistributed amplifieron-chip compensateCMOS technology

王兴华,仲顺安.带有片上补偿电感的CMOS分布式放大器的设计与分析[EB/OL].(2014-02-24)[2025-08-11].http://www.paper.edu.cn/releasepaper/content/201402-462.点此复制

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