泛林Vector express设备硅片边缘缺陷改善
Lam Vector express equipment Wafer Edge Defect improveing
泛林vector express设备 由于自身设计的缺陷，硅片边缘缺陷在其所有缺陷事件当中 占比达到80%以上，本文通过反复实验验证最终找到了硅片边缘缺陷的根本原因， 采取优化设备保养过程中及保养后的复机流程，可以有效地解决由于机台设计缺陷所造成的边缘缺陷问题，提高了产品的良率和可靠性
Lam vector express devices due to their own deficiencies of design, wafer edge defect in all its defect events accounted for more than 80%, through repeated experiments finally found the root cause of the wafer edge defect.The optimization of equipment maintenance process and recovery flow after maintenance can effectively solve the problem of edge defects due to machine design defects, and improve the yield and reliability of the product
张欣、刘涛
半导体技术
硅片边缘缺陷设备保养传送良率
Wafer edgedefectequipment maintenancetransferyield
张欣,刘涛.泛林Vector express设备硅片边缘缺陷改善[EB/OL].(2017-10-13)[2025-08-24].http://www.paper.edu.cn/releasepaper/content/201710-38.点此复制
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