聚苯胺/银基柔性电路的构建与应用

In this paper, polyaniline was employed as the substrate of the flexible circuits, and silver nanoparticles were used as the conductivity-enhanced filler to manufacture the high-conductivity composites. The doping-dedoping-redoping method was used to develop the conductivity of polyaniline, and the dispersion of the silver nanoparticles in polyaniline was particularly studied. We used the screen-print method to prepare the polyaniline/Ag based flexible circuits, the sizes of which can reach micron grade and the conductivity can reach more than 100 S/cm.