三元 Ni-Cu-Sn 合金的枝晶生长和显微硬度
endritic growth and microstructure hardness of undercooled ternary Ni-Cu-Sn alloys
枝晶生长对金属材料的组织演变过程和机械性能变化有着非常重要的作用。本文采用熔融玻璃净化法研究了三元Ni-5%Cu-5%Sn和 Ni-10%Cu-10%Sn 合金中α(Ni)相的枝晶生长和显微硬度特征，系统测定了α(Ni)相的枝晶生长速度随过冷度的变化规律。在实验中分别获得了 304K (0.18TL) 和 286K (0.17TL)的最大过冷度，相应的枝晶生长速度分别为 39.8 和25.1 m/s。深过冷引起了α(Ni)相枝晶由粗大的树枝晶向细小等轴晶的转变。随着过冷度的增大，α(Ni)相的晶粒尺寸显著减小，其显微硬度明显增加。溶质组元Cu和Sn的引入降低了α(Ni)相的枝晶生长速度，但是增强了α(Ni)相的显微硬度。
endritic growth plays an important role in the microstructure evolution and mechanical property of metallic alloys. Here, the dendritic growth velocity and microhardness of α(Ni) phase within highly undercooled ternary Ni-5%Cu-5%Sn and Ni-10%Cu-10%Sn alloys are investigated. At the experimental maximum undercoolings of 304K (0.18TL) and 286K (0.17TL) in the two alloys, the dendritic growth velocity attains 39.8 and 25.1 m/s, respectively. Large undercooling arouses the morphology transition from coarse dendrite into equiaxed dendrite. With the increase of undercooling, the grain size of α(Ni) phase decreases remarkably and the microhardness increases obviously. The rise of Cu and Sn solute contents reduces the dendritic growth velocity, but enhances the microhardness of α(Ni) phase.
黄帆、闫娜、李路远
材料科学金属学、热处理冶金技术
金属材料枝晶生长显微硬度过冷度
Metallic materialsdendrite growthmicrohardnessundercooling
黄帆,闫娜,李路远.三元 Ni-Cu-Sn 合金的枝晶生长和显微硬度[EB/OL].(2016-06-01)[2025-08-02].http://www.paper.edu.cn/releasepaper/content/201606-14.点此复制
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