纳米压痕法研究80Au/20Sn焊料热力性能

Eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics industries for its solder joint with high reliability. The knowledge of thermomechanical properties of the solder at small volume size and at elevated temperatures is critical for the package design and its reliability assessment. In this study, the thermomechanical behaviors of the 80Au/20Sn solder was investigated by nanoindentaion testing instead of the traditional test methods such as standard tensile and uniaxial tensile creep testing. The results showed that the load-displacement curves depended on the loading rate, applied load and temperature strongly, and the causes were analyzed. The elastic modulus and hardness were obtained at different loading rate, applied load, and temperature.