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ZnO退火中存在的问题

the Problems about ZnO Annealing

中文摘要英文摘要

由于光电子技术、信息技术、航空航天等高技术领域对短波长发光器件的迫切需求,ZnO等宽禁带半导体成为世界范围内的研究热点。在ZnO的p型掺杂杂质激活、欧姆接触和提高单晶质量等研究中,高温退火是必不可少的工艺。目前ZnO高温退火工艺是在ZnO表面裸露的情况下进行的,当退火温度较高时,ZnO表面将发生分解;同时ZnO结构、光学及电学特性与退火条件的关系有所不同;此外,在较高温度下退火时,ZnO薄膜内部的本征缺陷增多,这不利于实现ZnO的p型掺杂。

ue to the urgent need of the opto-electronics, information technology, aerospace and other high-tech field to short wavelength light-emitting devices, ZnO and other wide band gap semiconductor material had become research hot spots around the world. During researching impurity activation of p-type ZnO doping, ohmic contacts and improving the quality of ZnO single-crystal, high-temperature annealing process is essential. At present, ZnO surface is bare during high-temperature annealing process. when the annealing temperature is high, ZnO surface will be decomposed; At the same time, ZnO structure, optical and electrical properties of ZnO had the different change law with the annealing conditions; In addition, Annealing at higher temperatures, the intrinsic defects of ZnO thin films will increase, which is disadvantage to realizing p-type ZnO doping.

张贺秋、胡礼中

光电子技术半导体技术物理学

ZnO光电薄膜退火

ZnOphotoelectric thin filmannealing

张贺秋,胡礼中.ZnO退火中存在的问题[EB/OL].(2009-05-12)[2025-08-06].http://www.paper.edu.cn/releasepaper/content/200905-289.点此复制

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