氧化成键动力学与运动学：化学键-能带-表面势垒相关理论及应用
Oxidation bonding kinetics: BBB correlation and its application (digest)
his report focus on the recent progress in understanding the behaviour of atoms and valence electrons involved in the process of oxidation, and some technological development driven by the new knowledge. Supplementary multimedia movie showing four-stage Cu3O2 bonding kinetics and the full article are available at: http://www.ntu.edu.sg/home/ECQSun/Cu3O2-kinetics.swf http://www.ntu.edu.sg/home/ecqsun/rtf/JPMS.pdf
his report focus on the recent progress in understanding the behaviour of atoms and valence electrons involved in the process of oxidation, and some technological development driven by the new knowledge. Supplementary multimedia movie showing four-stage Cu3O2 bonding kinetics and the full article are available at: http://www.ntu.edu.sg/home/ECQSun/Cu3O2-kinetics.swf http://www.ntu.edu.sg/home/ecqsun/rtf/JPMS.pdf
孙长庆
化学电化学工业
OXidation bond formation surface and interface
OXidation bond formation surface and interface
孙长庆.氧化成键动力学与运动学：化学键-能带-表面势垒相关理论及应用[EB/OL].(2005-06-27)[2025-08-02].http://www.paper.edu.cn/releasepaper/content/200506-138.点此复制
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