椭偏技术在研究多孔低介电常数薄膜中的应用
pplication of Ellipsometry Technology to Character Porous Low k thin film
多孔低介电常数(Low k)材料有望作为集成电路互连介质的优良候选材料之一。椭偏技术不但可以快速、简捷、无损伤的测出薄膜的光学常数和膜厚,而且还可以用来研究多孔薄膜的微结构和机械特性,因此被广泛应用到多孔Low k薄膜研究中。本文分别从椭偏技术原理及其发展、椭偏技术在研究多孔Low k薄膜微结构和杨氏模量中的应用三个方面,归纳和分析了近年来椭偏技术在多孔Low k薄膜研究中应用进展,并对椭偏技术在该领域的今后研究和发展进行了展望。
Porous Low k material are promising candidates in applications such as intermetal dielectrics (IMD)in microelectronics. Not only optical constant and thickness of thin film can be got quickly by ellipsometry technology without destructivity, but also microstructure and Young’s Modulus of porous Low k thin films can be characterized. So ellipsometry technology are ued to study porous Low k thin films. In this paper, the research progress and trend of ellipsometry technology are summarized with emphases on basic principle and development, characterize microstructure , characterize Young’s Modulus. The future for the developments of ellipsometry technology are also proposed.
刘雪芹、黄春奎、许金海
微电子学、集成电路光电子技术材料科学
椭偏技术孔隙率孔径分布杨氏模量
Ellipsometry TechnologyPorousityPore size distributionYoung’s modulus
刘雪芹,黄春奎,许金海.椭偏技术在研究多孔低介电常数薄膜中的应用[EB/OL].(2008-03-21)[2025-08-02].http://www.paper.edu.cn/releasepaper/content/200803-636.点此复制
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