集群磁流变效应微磨头平面研抛加工参数研究
n experimental study of the planarization technique with an instantaneous tiny-grinding wheel cluster based on magnetorheological effect
在集群磁流变效应微磨头平面研抛加工技术初步研究的基础上，实验研究了磁感应强度、研抛压力、加工速度及加工时间等参数对材料去除率和表面粗糙度的影响规律，提出了集群磁流变效应微磨头平面研抛加工的材料去除模型，并得到了一定条件下的优化工艺参数。
Based on the new planarization polishing technique with an instantaneous tiny-grinding wheel cluster based on the magnetorheological (MR) effect, some experiments were conducted to reveal the influence of process parameters, such as magnetic field intensity, polishing pressure, rotate speed and polishing time, on the material removal rate and the surface roughness, and some optimized parameters under certain conditions were achieved. Furthermore, the material removal model of an instantaneous tiny-grinding wheel cluster was presented to describe the effect of process parameters during the planarization process.
汤爱军、路家斌、阎秋生、高伟强
工程基础科学材料科学通用技术、通用设备
集群微磨头磁流变效应平面研抛材料去除模型
iny-grinding wheel clusterMagnetorheological effectPlanarization polishingMaterial removal model
汤爱军,路家斌,阎秋生,高伟强.集群磁流变效应微磨头平面研抛加工参数研究[EB/OL].(2008-04-25)[2025-08-11].http://www.paper.edu.cn/releasepaper/content/200804-929.点此复制
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