|国家预印本平台
首页|在不同pH值模拟酸雨溶液中纯铜的腐蚀行为

在不同pH值模拟酸雨溶液中纯铜的腐蚀行为

orrosion Behavior of Pure Copper in Simulated Acid Rain of Different pH

中文摘要英文摘要

使用电化学阻抗(EIS)、X射线光电子能谱(XPS)和扫描电子显微镜(SEM)等手段, 研究了纯铜在不同pH值模拟酸雨溶液中的腐蚀行为。结果表明, 在不同pH值的模拟酸雨溶液中纯铜的阻抗谱特征有很大差异, 说明纯铜有不同的腐蚀机制。XPS分析结果表明, 在模拟酸雨溶液的pH值为3 时纯铜表面主要生成Cu2O, pH值为5 时表面主要生成CuO, pH值为6 时表面生成Cu2O和CuO的混合物。O2和H+共同影响纯铜的腐蚀历程, 在低pH值环境中腐蚀的控制步骤是溶解氧通过双电层的扩散, H+的存在起促进作用。随着pH值的升高H+的促进作用逐渐减弱, 纯铜的腐蚀主要受氧的去极化过程控制。

he corrosion behavior of pure copper in simulated acid rain of different pH was investigated by using electrochemistry impedance spectroscopy (EIS) and X- ray photoelectron spectroscopy (XPS) as well as SEM. The results show that the impedances of pure copper in simulated acid rain of different pH present various characteristic, indicating the different corrosion mechanisms. The results of XPS show that cuprous oxide only form on the surface of pure copper in pH=3 solution and cupric oxide only exist in pH=5 solution as well as the mixture of both oxides appear in pH=6 solution. The diffusion of O2 and H+ through solution may influence the corrosion process of pure copper. In low pH solution, the diffusion of dissolved oxygen through double electric layer is the rate-controlling step due to the promotion of the hydrogen ion. With increase of pH value, the oxygen of depolarization effect mainly control the corrosion process of pure copper without the effect of hydrogen ion.

钟万里、马元泰、梁永纯、聂铭、李瑛

10.12074/202303.00335V1

冶金技术

金属材料材料失效与保护纯铜酸雨腐蚀扩散

钟万里,马元泰,梁永纯,聂铭,李瑛.在不同pH值模拟酸雨溶液中纯铜的腐蚀行为[EB/OL].(2023-03-18)[2025-08-02].https://chinaxiv.org/abs/202303.00335.点此复制

评论