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注银钼箔无氰电镀银的研究

he Study on non- cyanogen Silver Electroplate Layers on Ag+ Implanted Molybdenum Substrate

中文摘要英文摘要

本实验采用无氰电镀工艺在离子注入银后的钼箔上进行了电镀银的实验,并和纯钼箔上直接无氰电镀银进行了对比。由SEM观察可知,采用先离子注入Ag后无氰电镀Ag工艺制备的镀银层相对于纯钼箔直接上电镀Ag工艺制备的镀银层其结构更致密,其导电性、耐蚀性及钎焊性也更好。然后本研究还对无氰电镀银配方进行了改进,结果表明,镀液加入硫代氨基脲后的镀银层晶粒变细、结构更致密。

In this paper carry out experiments of plating silver on implanted Ag+ molybdenum film adopting non-cyanogen technology,and compare with experiment of plating silver on pure molybdenum using the same plating technology. From the SEM results, we can conclude that the silver plating layer structure prepared by plating silver on implanted Ag+ molybdenum film is more compact than that prepared by plating silver on pure molybdenum, and having better conductance、bearing causticity、jointing performance. Then this paper ameliorates the non-cyanogen silver plating compositions, the results indicate that the crystal grain became more small of silver plating layer, and the structure became more compact.

吕海峰 、王玉林、万怡灶、何芳、黄远

电工材料冶金技术金属学、热处理

离子注入,无氰电镀,银离子,导电性,可焊性

ion implantation non- cyanogen plating Ag+ conductance jointing performance

吕海峰 ,王玉林,万怡灶,何芳,黄远.注银钼箔无氰电镀银的研究[EB/OL].(2007-05-15)[2025-08-02].http://www.paper.edu.cn/releasepaper/content/200705-196.点此复制

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