纳米结构Ni-TiN复合薄膜的电沉积及其腐蚀行为

he Ni-TiN nanocomposite film was successfully electrodeposited on brass copper substrates. The microstructures of the Ni-TiN nanocomposite film were investigated using scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Its average grain size was analyzed through X-ray diffraction (XRD), and its anti-corrosion property was studied through potentiodynamic scanning curves and Electrochemical Impedance Spectroscopy (EIS). The results show that the morphology of Ni-TiN composite film is sensitively dependent on the electroplating current density, TiN nanoparticle concentration, solution stirring speed, bath temperature and solution pH value. The average grain size of the optimized nanocomposite film is about 50 nm. Meanwhile, the Ni-TiN nanocomposite films are much more resistant to corrosion than pure Ni coatings.