动态拉伸载荷下SMT焊点可靠性研究
Research on Reliability of SMT Solder Joint In Dynamic Tensile Load
对Sn37Pb和Sn3.0Ag0.5Cu（SAC305）（wt %）钎料贴装的SMT组件进行了动态拉伸载荷下的机械疲劳试验研究，结果表明，Sn37Pb焊点的疲劳寿命要高于SnAgCu305。在峰值应力为40MPa时寿命差距达到最大，前者是后者2-3倍。同时，还分别得出了两种焊点在50%和10%破坏率下的S—N寿命曲线。通过对两种焊点试样横截面的显微观察，发现两种焊点均主要沿着三处位置开裂，然后随着疲劳周次的增加直至裂纹贯穿整个焊点。
In this paper, two groups of SMT assemblies are investigated in mechanical fatigue test of dynamic tensile load, the results show that the fatigue lifetime of Sn37Pb solder joints is better than SnAgCu305. When the stress value is 40MPa, life distance arrives to the maximum, and the former is the latter\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\\
王勇、林健、雷永平、张志政、赵海燕
电子元件、电子组件材料科学
SMT焊点疲劳破坏率
SMTsolder jointfatiguefailure rate
王勇,林健,雷永平,张志政,赵海燕.动态拉伸载荷下SMT焊点可靠性研究[EB/OL].(2008-11-28)[2025-08-16].http://www.paper.edu.cn/releasepaper/content/200811-859.点此复制
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