支持SAS2的高速背板设计与仿真
esign and Simulation of High Speed Backplane for SAS2 Signals Expander
本文介绍一种支持SAS2高速信号的背板的设计方案和仿真。给出背板系统的设计思路和方法,重点阐述系统硬件模块的组成和背板PCB(Printed Circuit Board)的设计,对含有大量高速信号的 PCB信号完整性进行了仿真,并对SAS2背板的板材选取进行了详细的探讨与研究。该背板可用于高性能存储网络的架设,实现主板与多个支持SAS2硬盘之间的互连。
design project and function realization of a kind of high- speed backplane for SAS2 signal expander is introduced in this paper. It presents structure and designing procedure of this system, emphasizes the composition of system hardware modules and the PCB designing, simulate the SAS2 signal about Singal Integrity on high-speed PCB and researches the selection for high speed backplane PCB material. The backplane can be used in high performance storage server and achevieve the interconnection between motherboard and SAS2 hardisks.
吴敏
电子电路电工技术概论电子技术应用
SAS2背板印制电路板材质信号完整性
SAS2backplanePCB materialSignal Integrity
吴敏.支持SAS2的高速背板设计与仿真[EB/OL].(2010-09-26)[2025-08-21].http://www.paper.edu.cn/releasepaper/content/201009-554.点此复制
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