Z-pin增强C/SiC力学行为研究
ensile behavior of C/SiC with Z-pins Reinforcement
研究Z-pin横向增强平纹编织陶瓷基复合材料的拉伸行为。碳纤维平纹编织物和碳纤维Z-pin制备的预制体,通过化学气相渗透(CVI)工艺制成Z-pin增强平纹编织陶瓷基复合材料。采用单轴拉伸试验及加-卸载试验研究材料拉伸力学性能参数及破坏机理。结果表明:Z-pin嵌入引起的面内纤维断裂、损伤以及弯曲变形,降低了平纹编织陶瓷基复合材料的拉伸强度;Z-pin增强平纹编织陶瓷基复合材料拉伸应力应变曲线具有非线性特性;卸载再加载过程中损伤基本没有增加,残余应变与卸载应力成二次关系,卸载模量与卸载应力成Boltzmann关系。初步得到Z-pin增强平纹编织陶瓷基复合材料的应力-应变关系。
ensile behavior of ceramic matrix composite (CMC) with Z-pins reinforcement was investigated. A preform consisting of plain-weave fabric and Z-pins through thickness reinforcements was infiltrated by chemical vapor infiltration (CVI) technique. The uniaxial unloading and reloading tensile test was used to investigate the tensile damage behavior. The fracture mechanism of the composite was studied by scanning electron microscopy (SEM). The result shows that the tensile strength of plain-weave ceramic matrix composite is reduced lesser because of damage, fracture and flexural deformation of the in plane fiber during pins insertion. The stress-strain curve of the laminate is nonlinear, and the damage undergoes slowly propagating, rapidly propagating and reaches saturation. The relationship between residual strain and unloading stress is quadratic function, and the relationship between unloading modulus and unloading stress is Boltzmann. The relationship between strain and stress of the laminate of plain-weave ceramic matrix composite is obtained.
矫桂琼、刘韦华
材料科学
Z-pin,平纹编织,陶瓷基复合材料,拉伸试验
Z-pinplain-weave ceramic matrix composites (CMC) tensile test
矫桂琼,刘韦华.Z-pin增强C/SiC力学行为研究[EB/OL].(2006-10-25)[2025-08-24].http://www.paper.edu.cn/releasepaper/content/200610-404.点此复制
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