多孔硅表面磁控溅射沉积钛膜的形貌研究
Morphology Study of Titanium Film Deposited on Silicon Macropores by Magnetron Sputtering
采用磁控溅射的方法来分别在随机刻蚀的多孔硅和孔径2.5 μm、12 μm、15 μm的多孔硅阵列上沉积钛膜。分别讨论了加偏压和不加偏压条件下沉积的钛膜的形貌,及多孔硅的刻蚀形貌对钛膜的影响。研究表明:未加偏压时,钛膜在多孔硅阵列上以柱状晶和岛装生长模式生长,在硅的原刻蚀纹路上堆积,造成沉积的阴影效应,钛膜均匀性差;施加偏压后,沉积的钛膜相对平整,离子经偏压加速后的再溅射效应有效减小了钛原子在硅刻蚀纹路和孔口边缘上的堆积,减小了表面和孔内的沉积厚度比,孔内的钛膜沉积深度达55 μm以上。可以看出,多孔硅的表面、孔壁形貌也会影响钛膜的形貌,平滑的孔壁要优于粗糙的孔壁。
itanium films were deposited on random etched silicon macropores and silicon macropore arrays with pore diameters of 2.5 μm, 12 μm, 15 μm. Morphologies of titanium films deposited with and without bias voltages and effect of etched silicon morphology on titanium film are discussed。The results without applied biases indicate that titanium film grow as columnar crystals and Volmer-Weber mode on silicon and a shadow effect is formed when titanium atoms are gathered on etched lines and edges of silicon. The results with applied biases indicate that the gathered titanium atoms on the etched lines and edges of silicon are reduced due to sputtering of the ions accelerated by bias. Consequently, the Ti thickness ratio of surface to pore bottom film is reduced. The deposition depth of titanium film in the macropores can reach more than 55 μm. It was clear that the morphologies of silicon macropores sureface and pore wall also pay an important role in the deposition of titanium film.
伍建春、邹宇、黄宁康、任丁、展长勇、蒋稳
半导体技术真空电子技术材料科学
薄膜物理学多孔硅磁控溅射偏压钛膜
film physicssilicon macroporesmagnetron sputteringbias voltagetitanium film
伍建春,邹宇,黄宁康,任丁,展长勇,蒋稳.多孔硅表面磁控溅射沉积钛膜的形貌研究[EB/OL].(2013-09-25)[2025-08-16].http://www.paper.edu.cn/releasepaper/content/201309-348.点此复制
评论