|国家预印本平台
首页|化学镀铜研究进展

化学镀铜研究进展

Research Progress on Electroless Copper Plating

中文摘要英文摘要

近年来,化学镀铜技术在表面处理行业中所占的地位在不断地上升,在电子工业、机械工业、航空航天等各行各业都有着越来越广泛的应用。有关化学镀铜的机理研究和工艺路线改进等课题已成为当今材料表面处理研究领域的热点之一。本文介绍了化学镀铜技术的发展概况和研究进展,综述了国内外近年来在化学镀铜领域所取得的一系列新的研究成果,并有针对性的指出了化学镀铜技术所面临的问题和未来的主要研究方向。

In recent years, the status of Electroless copper plating technique accounts for rise constantly in surface treating industry, all there is more and more extensive application in several fields including electronics industry, mechanical industry, Aero-Space, etc. The investigation on the technique of Electroless copper plating and improvement process has became one of the most interesting topics. In this paper, the general situation and the research progress of Electroless copper plating in recent years were reviewed, The advantages and disadvantages of the mentioned above were also pointed out.

田庆华、郭学益、闫剑锋

电化学工业金属学、热处理材料科学

化学镀铜研究进展机理表面技术预处理

Electroless copper platingResearch progressMechanismSurface technologypre-treatment

田庆华,郭学益,闫剑锋.化学镀铜研究进展[EB/OL].(2006-06-01)[2025-08-16].http://www.paper.edu.cn/releasepaper/content/200606-1.点此复制

评论